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SMT之家论文中心 / 相关行业标准 / 国际标准 / IPC技术标准目录之 电 子 组 装(Assembly)
IPC技术标准目录之 电 子 组 装(Assembly)
2004-01-01    IPC.org    http://www.ipc.org.cn    点击: 30995
IPC技术标准目录之 电 子 组 装(Assembly)

IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits
电子电路互连与封装的定义和术语
IPC-S-100 Standards and Specifications Manual
标准和详细说明汇编手册
IPC-E-500 IPC Electronic Document Collection
已出版的IPC标准电子文档资料合订本
IPC-TM-650 Test Methods Manual
试验方法手册
IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program
静电释放控制过程(由静电释放协会制定)
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies
电气与电子组装件锡焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610C Acceptability of Electronic Assemblies
印制板组装件验收条件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison
IPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K Electronic Assembly Reference Set
电子组装成套手册,包括:IPC/EIA J-STD-001C,IPC-HDBK-001,IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
电缆和引线贴装的要求和验收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology
倒装芯片及芯片级封装技术的应用
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation
芯片直装技术实施导则
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
FC(倒装片)和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003 Chip Mounting Technology
芯片贴装技术
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology
球栅阵列 (BGA)及其它高密度封装技术的应用
IPC-7095 Design and Assembly Process Implementation for BGAs
球栅阵列的设计与组装过程的实施
IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls
BGA球形凸点的标准规范
IT-98000 JPL Chip Scale Packaging Guidelines
JPL 发布的CSP导则
注:IT (The California Institute of Technology)
JPL (The Jet Propulsion Laboratory)
IT-98080 JPL Ball Grid Array Packaging Guidelines
JPL 发布的BGA封装导则
IT-98093 ITRI Chip Carrier, Phase 1 Report
ITRI 关于芯片载体的报告
ITRI (The Interconnect Technology Research Institute)
IPC-MC-790 Guidelines for Multichip Module Technology Utilization
多芯片组件技术应用导则
IPC-M-108 Cleaning Guides and Handbook Manual
清洗导则和手册
IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?
电路板离子洁净度测量:它告诉我们什么?
IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies
印制板及组装件清洗导则
IPC-SC-60A Post Solder Solvent Cleaning Handbook
锡焊后溶剂清洗手册
IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook
锡焊后半水溶剂清洗手册
IPC-AC-62A Aqueous Post Solder Cleaning Handbook
锡焊后水溶液清洗手册
IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed
Circuit Assemblies
电化学迁移:印制电路组件的电气诱发故障
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results
清洗及清洁度试验计划1阶段试验结果
IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air
IPC第3阶段非清洗助焊剂研究
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing
深入离子洁净度测试
IPC-9201 Surface Insulation Resistance Handbook
表面绝缘电阻手册
IPC-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,
Part 1 & Part 2第3阶段水溶性助焊剂清洗,第一和第二部分
IPC-M-109 Component Handling Manual
元件处理手册
IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
非密封固态表面贴装器件湿度/再流焊敏感度分类
IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
非气密封装电子元件用声波显微镜
IPC-9500-K Set of four documents 9501-9504
9501至9504手册合订本
IPC-DRM-18F Component Identification Desk Reference Manual
零件分类标识手册
IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual
接插件焊接点评价手册
IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual
接插件焊接点评价手册
IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual
导线和端子预成形参考手册
IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual
电子组装基础介绍手册
IPC-M-103 Standards for Surface Mount Assemblies Manual
所有SMT标准合订本
IPC-M-104 Standards for Printed Board Assembly Manual
10种常用印制板组装标准合订本
IPC-TA-722 Technology Assessment of Soldering
锡焊技术精选手册
IPC-TA-723 Technology Assessment Handbook on Surface Mounting
表面安装技术精选手册
IPC-TA-724 Technology Assessment Series on Clean Rooms
清洁室技术精选系列
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting
以表面安装为主的元件封装及互连导则
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
表面安装焊接件加速可靠性试验导则
IPC-PD-335 Electronic Packaging Handbook
电子封装手册
IPC-7525 Stencil Design Guidelines
网版设计导则
IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study
IPC第3阶段受控气氛焊接研究
IPC-MI-660 Incoming Inspection of Raw Materials Manual
原材料接收检验手册
IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1
锡焊焊剂要求(包括修改单1)
IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1
焊膏技术要求(包括修改单1)
IPC-HDBK-005 Guide to Solder Paste Assessment
焊膏性能评价手册
IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives
表面安装用介电粘接剂通用要求
IPC-CA-821 General Requirements for Thermally Conductive Adhesives
导热胶粘剂通用要求
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
表面贴装导电胶使用指南
IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films
各向异性导电胶膜的一般要求
IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印制板组装电气绝缘性能和质量手册
IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings
敷形涂层的设计,选择和应用手册
IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1
永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840 Guide to Solder Paste Assessment
焊膏性能评价手册
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001
基于J-STD-001组装工艺雷氏选择法
IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes)
J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820 Assembly & Joining Handbook
装联手册
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes
新型助焊剂雷氏选择法
IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process
低残留不清洗工艺的选择和实施
IPC-S-816 SMT Process Guideline & Checklist
表面安装技术过程导则及检核表
IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表
IPC-CM-770D Component Mounting Guidelines for Printed Boards
印制板元件安装导则
IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261 In-Process DPMO and Estimated Yield for PWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价
IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components
电子元件的印制板组装焊接过导则
IPC-9503 Moisture Sensitivity Classification for Non-IC Components
非集成电路元件的湿度敏感度分级
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
非集成电路元件的组装过程模拟评价(非集成电路元件预处理)
IPC-9850-K Surface Mount Placement Equipment Characterization-KIT
表面贴装设备性能检测方法的描述(附Gerber格式CD盘)
IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization
表面贴装设备性能测试用的标准工具包
• 4 IPC-9850 Placement Accuracy Verification Panels
• 1 IPC-9850 CMM Measurement Verification Panels
• 150 IPC-9850 QFP-100 Glass Components
• 130 IPC-9850 QFP-208 Glass Components
• 150 IPC-9850 BGA-228 Glass Components
• NIST Traceable Measurement Certificate
• Custom Storage Case
IPC-7711/21 7711 & 7721 Package
合订本
IPC-7711 Rework of Electronic Assemblies
电子组装件的返工
IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies
印制板和电子组装件的修复与修正
IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIA J-STD-003 Solderability Tests for Printed Boards
印制板可焊性试验
IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
带保护性涂层印制板长期贮存的可焊性评价
IPC-TR-464 Accelerated Aging for Solderability Evaluations
可焊性加速老化评价(附修订)
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA
替代涂覆层的蒸汽老化评价
IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test
技术报告: 润湿天平称重标准对比测试
SMC-WP-001 Soldering Capability White Paper Report
可焊性工艺导论
SMC-WP-005 PCB Surface Finishes
印制电路板表面清洗
更多内容,请浏览 http://www.ipc.org/onlinestore

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