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SMT之家论文中心 / 相关行业标准 / 国际标准 / IPC技术标准目录之 印 制 电 路 板
IPC技术标准目录之 印 制 电 路 板
2004-01-01    IPC.org    http://www.ipc.org.cn    点击: 24175
IPC技术标准目录之 印 制 电 路 板
IPC-M-105 Rigid Printed Board Manual
刚性印制板设计手册
IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求
IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly
印制板制造和组装的故障排除
IPC-6010 Series IPC-6010 Qualification and Performance Series
IPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011 Generic Performance Specification for Printed Boards
印制板通用性能规范
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范(包括修改单1)
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1)
IPC-6018A Microwave End Product Board Inspection and Tech
微波成品印制板的检验和测试
IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections
有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范
IPC-A-600F Acceptability of Printed Boards
印制板验收条件
IPC-QE-605A Printed Board Quality Evaluation Handbook
印制板质量评价
IPC-QE-605A-KIT Hard Copy and CD
印制板质量评价书和光盘(CD)
IPC-HM-860 Specification for Multilayer Hybrid Circuits
多层混合电路规范
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards
聚合物厚膜印制板的鉴定与性能
IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范
IPC-TR-481 Results of Multilayer Tests Program Round Robin
多层印制板联合试验计划结果
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
用于电子元件安装与互连的印制板质量评价
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs
印制板中小直径镀覆孔可靠性评价联合试验
IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards
印制电路板表面非电镀镍/沉金规范
IPC-DR-572 Drilling Guidelines for Printed Boards
印制板钻孔导则
IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias
印制板通孔机加工方案的改进和优选手册
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers
钻床和铣床用计算机数字控制格式
IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines
施加阻焊前及施加后清洗导则
IPC-HDI-1 High Density Interconnect Microvia Technology Compendium
高密度(HDI)互连微通孔技术纲要
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials
高密度互连(HDI)及微导通孔材料规范
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范
IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection
积层/高密度互连的术语和定义、试验方法与设计例
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
多芯片组件内层有机绝缘材料的鉴定试验
IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1
高密度印制板微通孔评价指标手册, 第一期第一版
IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2
高密度印制板微通孔评价指标手册, 第一期第二版
IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3
高密度印制板微通孔评价指标手册, 第一期第三版
IT-98123 Microvia Manufacturing Technology Cost Analysis Report
微通孔制作技术成本核算报告
IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design
控制阻抗电路板与高速逻辑设计
IPC-2252 Design Guide for RF/Microwave Circuit Boards
射频/微波电路板设计指南
IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications
高速高频用基材规范
IPC-6018A Microwave End Product Board Inspection and Test
微波成品印制板的检验和测试
IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
采用高速技术电子封装设计导则
IPC-M-102 Flexible Circuits Compendium
挠性电路纲要
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry
挠性印制线路用挠性绝缘基底材料
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
挠性印制线路覆盖层用涂粘接剂绝缘薄膜
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
挠性金属箔去电应用于柔性电路组装
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1
挠性印制板的鉴定与性能规范(包括修改单1)
IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC/JPCA单双面挠性印制板性能手册
IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits
单面和双面挠性电路组装导则
IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范
IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则
IPC-M-107 Standards for Printed Board Materials Manual 印制板材料标准手册
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards
刚性及多层印制板用基材规范
IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则
IPC-4562 Metal Foil for Printed Wiring Applications
印制线路用金属箔
IPC-CF-148A Resin Coated Metal for Printed Boards
印制板用涂树脂金属箔
IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范
IPC-TR-482 New Developments in Thin Copper Foils
薄铜箔的新发展
IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study
IPC铜箔延展性联合研究结果
IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study
铜箔断裂强度试验联合研究结果
IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed Boards
“E”类精纺玻璃纤维层印制板技术规范
IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Materials
E 玻璃纤维非织布材料规范及性能确定方法
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
印制板用纤维纸规范及性能确定方法
IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1
聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1
IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1
关于聚芳基酰胺非织布规范及性能确定方法的修改单 1
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards
印制板用经处理S玻璃纤维织物规范
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards
印制板用经处理聚芳酰胺纤维编织物规范
IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
印制板用经处理石英(熔融纯氧化硅)纤维编织物规范
IPC-2524 PWB Fabrication Data Quality Rating System
印制板制造数据质量定级体系
IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database
印制板工艺, 容量, 质量,可靠性试验标准和数据库
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC)
实施统计过程控制(SPC)的通用导则
IPC-9199 Statistical Process Control (SPC) Quality Rating
统计分析控制
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
未组装印制板电测试要求和指南
IT-97061 PWB Hole to Land Misregistration: Causes and Reliability
印制线路板通孔与焊盘的错位: 原因和可靠性
IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels
多层板内部无焊盘层互连错位的可靠性
IPC-MS-810 Guidelines for High Volume Microsection
大批量显微剖切导则
IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
印制板、元器件及材料检验试验设备的认证
IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test
薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告
IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation
内层分离的互连应力测试(IST)与显微剖切相关性联合研究
更多内容,请浏览 http://www.ipc.org/onlinestore
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